Request a quote for pricing
Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Terminal Formu
- BALL
- Part Life Cycle Code
- Active
- Terminal Kaplaması
- TIN SILVER COPPER
- Operating Temperaturemax
- 110 °C
- Package Description
- FCBGA-625
- Temperature Grade
- OTHER
- Bus Compatibility
- CAN, I2C, SPI, UART
- Upsucsperipheral Ics Type
- PROGRAMMABLE SoC
- Moisture Sensitivity Levels
- 4
- Yüzey Montaj
- YES
- Package Shape
- SQUARE
- Genişlik
- 21 mm
- Jesd30 Code
- S-PBGA-B625
- Package Body Material
- PLASTIC/EPOXY
- Package Style
- GRID ARRAY, FINE PITCH
- REACH Uyumluluk Kodu
- compliant
- Terminal Adımı
- 0.8 mm
- Rohs Code
- Yes
- Supply Voltagenom
- 0.85 V
- JESD-609 Kodu
- e1
- Terminal Pozisyonu
- BOTTOM
- Uzunluk
- 21 mm
- Package Code
- FBGA
- Seated Heightmax
- 3.43 mm
- Package Equivalence Code
- BGA625,25X25,32
- Number Of Terminals
- 625
- Ihs Manufacturer
- ADVANCED MICRO DEVICES INC
Related Products
Echelon Corporation
14235R-ES
Application Specific Microcontrollers
Echelon Corporation
14305R-ES
Application Specific Microcontrollers
Echelon Corporation
14410R-500
Application Specific Microcontrollers
Echelon Corporation
14450R-500
Application Specific Microcontrollers
Echelon Corporation
14550R-500
Application Specific Microcontrollers
Echelon Corporation
15311R-1000
Application Specific Microcontrollers
Echelon Corporation
15311R-5
Application Specific Microcontrollers
Echelon Corporation
15321R-1000
Application Specific Microcontrollers

