XCZU3CG-1LSFVC784I

Specifications

Uzunluk

23 mm

Package Equivalence Code

BGA784,28X28,32

Package Code

FBGA

Seated Heightmax

3.32 mm

Operating Temperaturemin

-40 °C

Number Of Terminals

784

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Package Body Material

PLASTIC/EPOXY

Terminal Adımı

0.8 mm

REACH Uyumluluk Kodu

compliant

Package Style

GRID ARRAY, FINE PITCH

JESD-609 Kodu

e1

Terminal Pozisyonu

BOTTOM

Supply Voltagenom

0.85 V

Rohs Code

Yes

Bus Compatibility

CAN, I2C, SPI, UART

Temperature Grade

INDUSTRIAL

Moisture Sensitivity Levels

4

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Yüzey Montaj

YES

Package Shape

SQUARE

Jesd30 Code

S-PBGA-B784

Genişlik

23 mm

Terminal Formu

BALL

Operating Temperaturemax

100 °C

Tepe Reflow Süresi (maks. sn)

30

Tepe Reflow Sıcaklığı (°C)

250

Part Life Cycle Code

Active

Terminal Kaplaması

TIN SILVER COPPER

Package Description

FCBGA-784