XCZU2EG-1LSFVA625I

Specifications

Package Equivalence Code

BGA625,25X25,32

Package Code

FBGA

Seated Heightmax

3.43 mm

Operating Temperaturemin

-40 °C

Uzunluk

21 mm

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Number Of Terminals

625

Package Body Material

PLASTIC/EPOXY

Terminal Pozisyonu

BOTTOM

JESD-609 Kodu

e1

Supply Voltagenom

0.85 V

Rohs Code

Yes

Terminal Adımı

0.8 mm

REACH Uyumluluk Kodu

compliant

Package Style

GRID ARRAY, FINE PITCH

Moisture Sensitivity Levels

4

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Bus Compatibility

CAN, I2C, SPI, UART

Temperature Grade

INDUSTRIAL

Jesd30 Code

S-PBGA-B625

Genişlik

21 mm

Package Shape

SQUARE

Yüzey Montaj

YES

Terminal Formu

BALL

Package Description

FCBGA-625

Operating Temperaturemax

100 °C

Part Life Cycle Code

Active

Terminal Kaplaması

TIN SILVER COPPER