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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Jesd30 Code
- R-PBGA-B625
- Yüzey Montaj
- YES
- Paket
- Tray
- Temel Ürün No
- XCZU2
- Supply Voltagemin Vsup
- 0.825V
- Terminal Sayısı
- 625
- Upsucsperipheral Ics Type
- MICROPROCESSOR CIRCUIT
- Yayın Yılı
- 2016
- Number Of Ios
- 180
- Ratings
- Environment Resistant
- Ambalaj
- Bulk
- Seri
- Zynq® UltraScale+™ MPSoC CG
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Terminal Kaplaması
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Pin Sayısı
- 23
- Montaj
- Flanges, Panel, Through Hole
- RoHS Durumu
- ROHS3 Compliant
- Terminal Formu
- BALL
- Kılıf / Paket
- 625-BFBGA, FCBGA
- Besleme Gerilimi
- 0.85V
- Primary Attributes
- Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
- HTS Kodu
- 8542.31.00.01
- Ürün Durumu
- Active
- Core Processor
- Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Parça Durumu
- Active
- Min. Çalışma Sıcaklığı
- -65 °C
- RoHS
- Compliant
- Fabrika Tedarik Süresi
- 11 Weeks
- Speed
- 533MHz, 1.3GHz
- Peripherals
- DMA, WDT
- Connector Type
- Receptacle
- Tedarikçi Cihaz Paketi
- 625-FCBGA (21x21)
- Ram Size
- 256KB
- Fastening Type
- Threaded
- Contact Plating
- Gold
- JESD-609 Kodu
- e1
- Terminal Pozisyonu
- BOTTOM
- Özellikler
- Shielded
- Architecture
- MCU, FPGA