XCZU2CG-2LSFVC784I

Specifications

Package Body Material

PLASTIC/EPOXY

Rohs Code

Yes

Supply Voltagenom

0.85 V

JESD-609 Kodu

e1

Terminal Pozisyonu

BOTTOM

Package Style

GRID ARRAY, FINE PITCH

REACH Uyumluluk Kodu

compliant

Terminal Adımı

0.8 mm

Operating Temperaturemin

-40 °C

Package Code

FBGA

Seated Heightmax

3.32 mm

Package Equivalence Code

BGA784,28X28,32

Uzunluk

23 mm

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Number Of Terminals

784

Terminal Formu

BALL

Package Description

FCBGA-784

Part Life Cycle Code

Active

Terminal Kaplaması

TIN SILVER COPPER

Tepe Reflow Sıcaklığı (°C)

250

Operating Temperaturemax

100 °C

Tepe Reflow Süresi (maks. sn)

30

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Moisture Sensitivity Levels

4

Temperature Grade

INDUSTRIAL

Bus Compatibility

CAN, I2C, SPI, UART

Genişlik

23 mm

Jesd30 Code

S-PBGA-B784

Yüzey Montaj

YES

Package Shape

SQUARE