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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Seri
- SiT8209
- Ambalaj
- Tape & Reel (TR)
- Frequency Stability
- ±10ppm
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Current Supply Disable Max
- 30mA
- RoHS Durumu
- ROHS3 Compliant
- Kılıf / Paket
- 4-SMD, No Lead
- Base Resonator
- MEMS
- Output
- LVCMOS, LVTTL
- Primary Attributes
- Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
- HTS Kodu
- 8542.31.00.01
- Current Supply Max
- 33mA
- Temel Ürün No
- XCZU19
- Paket
- Tray
- Boyut / Ölçü
- 0.126 L x 0.098 W (3.20mm x 2.50mm)
- Number Of Ios
- 308
- Yayın Yılı
- 2016
- Tip
- XO (Standard)
- Besleme Gerilimi
- 1.8V
- Nem Hassasiyeti (MSL)
- 4 (72 Hours)
- Architecture
- MCU, FPGA
- Maks. Oturma Yüksekliği
- 0.032 (0.80mm)
- Çalışma Sıcaklığı
- -40°C ~ 85°C
- Connectivity
- CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Ürün Durumu
- Active
- Frekans
- 125MHz
- Core Processor
- Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Parça Durumu
- Active
- Peripherals
- DMA, WDT
- Fabrika Tedarik Süresi
- 11 Weeks
- Speed
- 600MHz, 667MHz, 1.5GHz
- Tedarikçi Cihaz Paketi
- 1760-FCBGA (42.5x42.5)
- Montaj Tipi
- Surface Mount
- Function
- Enable/Disable
- Ram Size
- 256KB