Request a quote for pricing
Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Tedarikçi Cihaz Paketi
- 676-FCBGA (27x27)
- Tepe Reflow Sıcaklığı (°C)
- 245
- Çalışma Sıcaklığı
- 0 to 100 °C
- Peripherals
- DMA
- Terminal Adımı
- 1mm
- Jesd30 Code
- S-PBGA-B676
- Maks. Oturma Yüksekliği
- 2.54mm
- Tip
- Cover, Lid
- Kılıf / Paket
- 676-BBGA, FCBGA
- Supply Voltagemax Vsup
- 1.05V
- Parça Durumu
- Active
- Renk
- Clear
- Architecture
- MCU, FPGA
- Terminal Sayısı
- 676
- Seri
- DMB
- Terminal Pozisyonu
- BOTTOM
- Number Of Cpu Cores
- 2
- Ram Size
- 256KB
- Instruction Set Architecture
- Thumb-2
- Boundary Scan
- YES
- Speed
- 1GHz
- Connectivity
- CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- HTS Kodu
- 8542.39.00.01
- Paket
- Tray
- Material
- Plastic, ABS/PC Blend
- Data Bus Width
- 32 Bit
- Ram Words
- 256000
- Speed Grade
- -3
- Core Architecture
- ARM
- Terminal Kaplaması
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Number Of Ios
- 130
- Operating Supply Voltage
- 5.25, 4.75, 5 V
- Core Processor
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Yayın Yılı
- 2009
- Memory Types
- ROMless
- JESD-609 Kodu
- e1
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Radyasyon Dayanımı
- No
- Fabrika Tedarik Süresi
- 10 Weeks
- Temel Ürün No
- XC7Z045

