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C3 ChipZentronix

AMD

XC7Z035-L2FFG900I

SoC

RoHS: Compliant

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RoHS

Compliant

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Specifications

Paket
Tray
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
HTS Kodu
8542.39.00.01
Speed
800MHz
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
ECCN Kodu
3A991.D
Boundary Scan
YES
Primary Attributes
Kintex™-7 FPGA, 275K Logic Cells
Ram Size
256KB
Tepe Reflow Süresi (maks. sn)
30
Frekans
800MHz
Besleme Gerilimi
1V
Terminal Kaplaması
Tin/Silver/Copper (Sn/Ag/Cu)
Ürün Durumu
Active
Additional Feature
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Core Architecture
ARM
Number Of Ios
130
Terminal Formu
BALL
Ambalaj
Tray
Ram Words
256000
RoHS Durumu
ROHS3 Compliant
Maks. Oturma Yüksekliği
3.35mm
Supply Voltagemin Vsup
0.95V
Jesd30 Code
S-PBGA-B900
Kılıf / Paket
900-BBGA, FCBGA
Nem Hassasiyeti (MSL)
4 (72 Hours)
JESD-609 Kodu
e1
Tepe Reflow Sıcaklığı (°C)
245
Çalışma Sıcaklığı
-40°C ~ 100°C (TJ)
Tedarikçi Cihaz Paketi
900-FCBGA (31x31)
Terminal Adımı
1mm
Yayın Yılı
2010
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Architecture
MCU, FPGA
Terminal Pozisyonu
BOTTOM
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Seri
Zynq®-7000
Terminal Sayısı
900
Uzunluk
31mm

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