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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Ram Size
- 256KB
- Min Supply Voltage
- 950mV
- Montaj
- Surface Mount
- Contact Plating
- Copper, Silver, Tin
- Tepe Reflow Süresi (maks. sn)
- 30
- Boundary Scan
- YES
- ECCN Kodu
- 3A991.D
- Connectivity
- CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed
- 800MHz
- Paket
- Tray
- Propagation Delay
- 100 ps
- Primary Attributes
- Kintex™-7 FPGA, 275K Logic Cells
- Speed Grade
- 2
- Ambalaj
- Tray
- RoHS Durumu
- ROHS3 Compliant
- Core Architecture
- ARM
- Additional Feature
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- Ürün Durumu
- Active
- Frekans
- 800MHz
- Besleme Gerilimi
- 1V
- Terminal Kaplaması
- Tin/Silver/Copper (Sn/Ag/Cu)
- Terminal Formu
- BALL
- Number Of Ios
- 130
- Tedarikçi Cihaz Paketi
- 900-FCBGA (31x31)
- Number Of Registers
- 343800
- Tepe Reflow Sıcaklığı (°C)
- 245
- Çalışma Sıcaklığı
- -40°C ~ 100°C (TJ)
- Peripherals
- DMA
- Core Processor
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Yayın Yılı
- 2010
- Terminal Adımı
- 1mm
- Jesd30 Code
- S-PBGA-B900
- Maks. Oturma Yüksekliği
- 3.35mm
- JESD-609 Kodu
- e1
- Nem Hassasiyeti (MSL)
- 4 (72 Hours)
- Kılıf / Paket
- 900-BBGA, FCBGA
- Genişlik
- 31mm
- Fabrika Tedarik Süresi
- 10 Weeks
- Parça Durumu
- Active
- Temel Ürün No
- XC7Z035