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C3 ChipZentronix

AMD

XC7Z035-2FFG900E

SoC

RoHS: Compliant

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RoHS

Compliant

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Specifications

Primary Attributes
Kintex™-7 FPGA, 275K Logic Cells
Propagation Delay
100 ps
Paket
Tray
Boundary Scan
YES
ECCN Kodu
3A991.D
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed
800MHz
Contact Plating
Copper, Silver, Tin
Montaj
Surface Mount
Tepe Reflow Süresi (maks. sn)
30
Ram Size
256KB
Min Supply Voltage
950mV
Number Of Ios
130
Terminal Formu
BALL
Core Architecture
ARM
Terminal Kaplaması
Tin/Silver/Copper (Sn/Ag/Cu)
Besleme Gerilimi
1V
Frekans
800MHz
Ürün Durumu
Active
Additional Feature
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
RoHS Durumu
ROHS3 Compliant
Speed Grade
2
Ambalaj
Tray
JESD-609 Kodu
e1
Kılıf / Paket
900-BBGA, FCBGA
Nem Hassasiyeti (MSL)
4 (72 Hours)
Jesd30 Code
S-PBGA-B900
Maks. Oturma Yüksekliği
3.35mm
Yayın Yılı
2010
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Terminal Adımı
1mm
Number Of Registers
343800
Tedarikçi Cihaz Paketi
900-FCBGA (31x31)
Tepe Reflow Sıcaklığı (°C)
245
Çalışma Sıcaklığı
0°C ~ 100°C (TJ)
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Seri
Zynq®-7000
Terminal Sayısı
900
Uzunluk
31mm

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