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Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Tepe Reflow Sıcaklığı (°C)
- 260
- Architecture
- PLA-TYPE
- Part Life Cycle Code
- Obsolete
- Package Code
- LFBGA
- Terminal Pozisyonu
- BOTTOM
- Tepe Reflow Süresi (maks. sn)
- 30
- JESD-609 Kodu
- e1
- Terminal Kaplaması
- TIN SILVER COPPER
- Rohs Code
- Yes
- Package Shape
- SQUARE
- Uzunluk
- 6 mm
- Moisture Sensitivity Levels
- 3
- Package Body Material
- PLASTIC/EPOXY
- Additional Feature
- FAST ZERO POWER DESIGN TECHNOLOGY
- Genişlik
- 6 mm
- Programmable Logic Type
- FLASH PLD
- Supply Voltagemax
- 1.9 V
- Ihs Manufacturer
- ADVANCED MICRO DEVICES INC
- Package Description
- 6 X 6 MM, 0.50 MM PITCH, CSP-56
- Number Of Io Lines
- 45
- Clock Frequencymax
- 213 MHz
- Jesd30 Code
- S-PBGA-B56
- Package Style
- GRID ARRAY, LOW PROFILE, FINE PITCH
- REACH Uyumluluk Kodu
- compliant
- Organization
- 0 DEDICATED INPUTS, 45 I/O
- Package Equivalence Code
- BGA56,10X10,20
- Temperature Grade
- COMMERCIAL
- Number Of Macro Cells
- 64
- Output Function
- MACROCELL
- Terminal Adımı
- 0.5 mm
- Supply Voltagenom
- 1.8 V
- Propagation Delay
- 4 ns
- Number Of Outputs
- 45
- Number Of Inputs
- 45
- Yüzey Montaj
- YES
- Seated Heightmax
- 1.35 mm
- Terminal Formu
- BALL
- Operating Temperaturemax
- 70 °C
- Number Of Terminals
- 56
- Qualification Status
- Not Qualified