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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Temperature Grade
- OTHER
- Terminal Formu
- BALL
- Integrated Cache
- YES
- Terminal Pozisyonu
- BOTTOM
- Address Bus Width
- 13
- REACH Uyumluluk Kodu
- compliant
- Moisture Sensitivity Levels
- 3
- Format
- FLOATING POINT
- External Data Bus Width
- 64
- Jesd30 Code
- S-PBGA-B388
- Package Style
- GRID ARRAY, HEAT SINK/SLUG
- Speed
- 233 MHz
- Package Description
- HBGA, BGA388,26X26,50
- Ihs Manufacturer
- ADVANCED MICRO DEVICES INC
- Package Code
- HBGA
- Genişlik
- 35 mm
- Package Shape
- SQUARE
- Package Equivalence Code
- BGA388,26X26,50
- Bit Size
- 32
- Operating Temperaturemax
- 85 °C
- Number Of Terminals
- 388
- Part Package Code
- BGA
- Pin Sayısı
- 388
- Seated Heightmax
- 2.59 mm
- Upsucsperipheral Ics Type
- MICROPROCESSOR
- Supply Voltagemax
- 1.89 V
- Tepe Reflow Sıcaklığı (°C)
- 260
- ECCN Kodu
- 3A991.A.2
- JESD-609 Kodu
- e2
- Supply Voltagenom
- 1.8 V
- Uzunluk
- 35 mm
- Yüzey Montaj
- YES
- HTS Kodu
- 8542.31.00.01
- Boundary Scan
- YES
- Part Life Cycle Code
- Obsolete
- Rohs Code
- Yes
- Supply Voltagemin
- 1.71 V
- Terminal Adımı
- 1.27 mm
- Package Body Material
- PLASTIC/EPOXY
- Qualification Status
- Not Qualified