S72WS256NEEBFWUB0

Specifications

Memory Density

268435456 bit

Terminal Pozisyonu

BOTTOM

Standby Currentmax

0.00004 A

Yüzey Montaj

YES

Package Equivalence Code

BGA137,10X14,32

Number Of Words

16777216 words

Operating Mode

ASYNCHRONOUS

Supply Currentmax

0.06 mA

Memory Ic Type

MEMORY CIRCUIT

Jesd30 Code

R-PBGA-B137

Operating Temperaturemin

-25 °C

Access Timemax

70 ns

Number Of Terminals

137

Part Life Cycle Code

Active

Tepe Reflow Sıcaklığı (°C)

260

Moisture Sensitivity Levels

3

Part Package Code

BGA

Fonksiyon Sayısı

1

HTS Kodu

8542.32.00.71

Mixed Memory Type

FLASH+SDRAM

ECCN Kodu

EAR99

Package Description

FBGA, BGA137,10X14,32

Package Shape

RECTANGULAR

Memory Width

16

Organization

16MX16

Additional Feature

MOBILE SDRAM IS ORGANIZED AS 4M X 16BIT X 4 BANKS; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

Supply Voltagemax Vsup

1.95 V

Number Of Words Code

16000000

Seated Heightmax

1.4 mm

Package Code

FBGA

Terminal Formu

BALL

Terminal Kaplaması

TIN SILVER COPPER

Terminal Adımı

0.8 mm

Temperature Grade

OTHER

Supply Voltagenom Vsup

1.8 V

Qualification Status

Not Qualified

Genişlik

9 mm

Tepe Reflow Süresi (maks. sn)

40

Pin Sayısı

137

JESD-609 Kodu

e1