S71JL064HB0BAW01

Specifications

Operating Temperaturemax

85 °C

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Access Timemax

70 ns

Mixed Memory Type

FLASH+SRAM

Memory Ic Type

MEMORY CIRCUIT

Package Description

FBGA, BGA73,10X12,32

Package Style

GRID ARRAY, FINE PITCH

HTS Kodu

8542.32.00.71

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA73,10X12,32

Package Code

FBGA

Jesd30 Code

R-PBGA-B73

REACH Uyumluluk Kodu

compliant

Supply Voltagenom Vsup

3 V

ECCN Kodu

EAR99

Number Of Terminals

73

Rohs Code

Yes

Terminal Pozisyonu

BOTTOM

Part Life Cycle Code

Obsolete

Qualification Status

Not Qualified

Terminal Adımı

0.8 mm

Yüzey Montaj

YES

Temperature Grade

OTHER

Package Shape

RECTANGULAR

Operating Temperaturemin

-25 °C

Terminal Formu

BALL