Request a quote for pricing
Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Description
- BGA, BGA368,26X26,50
- HTS Kodu
- 8542.31.00.01
- Terminal Kaplaması
- TIN LEAD
- Part Life Cycle Code
- Active
- Bit Size
- 32
- Package Equivalence Code
- BGA368,26X26,50
- Terminal Adımı
- 1.27 mm
- Package Shape
- SQUARE
- JESD-609 Kodu
- e0
- Tepe Reflow Süresi (maks. sn)
- 30
- Terminal Formu
- BALL
- Jesd30 Code
- S-PBGA-B368
- Moisture Sensitivity Levels
- 3
- Upsucsperipheral Ics Type
- MICROPROCESSOR, RISC
- Tepe Reflow Sıcaklığı (°C)
- 220
- Yüzey Montaj
- YES
- Terminal Pozisyonu
- BOTTOM
- Package Code
- BGA
- Qualification Status
- Not Qualified
- REACH Uyumluluk Kodu
- compliant
- Rohs Code
- No
- Package Style
- GRID ARRAY
- Ihs Manufacturer
- ADVANCED MICRO DEVICES INC
- Package Body Material
- PLASTIC/EPOXY
- Number Of Terminals
- 368
- Speed
- 366 MHz