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Specifications
- Sıra Sayısı
- 2
- Upsucsperipheral Ics Type
- MICROPROCESSOR CIRCUIT
- Current Rating Amps
- 3A
- Contact Materials
- Copper Alloy
- Fabrika Tedarik Süresi
- 16 Weeks
- Contact Lengthmating
- 0.318 (8.08mm)
- HTS Kodu
- 8542.31.00.01
- Contact Finish Thickness Post
- 100.0µin (2.54µm)
- Technology
- CMOS
- Package Body Material
- PLASTIC/EPOXY
- Risk Rank
- 5.6
- Shrouding
- Unshrouded
- Terminal Formu
- BALL
- Ürün Durumu
- Active
- Number Of Positions Loaded
- All
- Contact Length Post
- 0.125 (3.18mm)
- Pitch Mating
- 0.100 (2.54mm)
- Overall Contact Length
- 0.533 (13.55mm)
- Connector Type
- Header, Breakaway
- Package Code
- BGA
- Ihs Manufacturer
- ADVANCED MICRO DEVICES INC
- Package Description
- BGA,
- Terminal
- Solder
- Temel Ürün No
- 146252
- Üretici Parça No
- GE209HISJ23HM
- Contact Finish Mating
- Gold
- Çalışma Sıcaklığı
- -65°C ~ 105°C
- Insulation Height
- 0.090 (2.29mm)
- Contact Type
- Male Pin
- Material Flammability Rating
- UL94 V-0
- Contact Finish Post
- Tin
- Pozisyon Sayısı
- 72
- Row Spacing Mating
- 0.100 (2.54mm)
- Yüzey Montaj
- YES
- Fastening Type
- Push-Pull
- Part Life Cycle Code
- Active
- Paket
- Bulk
- Seri
- AMPMODU Mod II
- Interface
- SPI/USB
- Contact Finish Thickness Mating
- 15.0µin (0.38µm)