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Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Part Package Code
- BGA
- Genişlik
- 8 mm
- Jesd30 Code
- R-PBGA-B63
- JESD-609 Kodu
- e0
- Package Body Material
- PLASTIC/EPOXY
- Terminal Pozisyonu
- BOTTOM
- Fonksiyon Sayısı
- 1
- Package Equivalence Code
- BGA63,8X12,32
- Sector Size
- 8K,64K
- Organization
- 2MX16
- Package Style
- GRID ARRAY, THIN PROFILE, FINE PITCH
- Tepe Reflow Sıcaklığı (°C)
- 260
- Memory Density
- 33554432 bit
- Number Of Sectorssize
- 8,63
- Terminal Adımı
- 0.8 mm
- HTS Kodu
- 8542.32.00.51
- Operating Temperaturemin
- -40 °C
- Part Life Cycle Code
- Transferred
- Uzunluk
- 14 mm
- Memory Ic Type
- FLASH
- Access Timemax
- 70 ns
- Number Of Words Code
- 2000000
- Supply Currentmax
- 0.045 mA
- Standby Currentmax
- 0.000005 A
- Pin Sayısı
- 63
- Package Description
- 8 X 14 MM, 0.80 MM PITCH, FBGA-63
- ECCN Kodu
- EAR99
- Toggle Bit
- YES
- Terminal Kaplaması
- Tin/Lead (Sn/Pb)
- Ihs Manufacturer
- ADVANCED MICRO DEVICES INC
- Supply Voltagemax Vsup
- 3.6 V
- Qualification Status
- Not Qualified
- Readybusy
- YES
- Common Flash Interface
- YES
- Seated Heightmax
- 1.2 mm
- Parallelserial
- PARALLEL
- Tip
- NOR TYPE
- REACH Uyumluluk Kodu
- unknown
- Number Of Words
- 2097152 words
- Temperature Grade
- INDUSTRIAL
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