EPXA4F672C3

Specifications

Program Sram Bytes

128K

Terminal Formu

BALL

Package Style

GRID ARRAY

Organization

0 DEDICATED INPUTS, 426 I/O

Besleme Gerilimi

1.8V

Package Shape

SQUARE

Üretici Parça No

EPXA4F672C3

Tepe Reflow Süresi (maks. sn)

30

Fpga Gates

400K

Ürün Tipi

Programmable Logic IC Development Tools

Ihs Manufacturer

INTEL CORP

Risk Rank

8.73

Package Body Material

PLASTIC/EPOXY

Jesd30 Code

S-PBGA-B672

Data Sram Bytes

64K

Yüzey Montaj

YES

Package Description

BGA,

Number Of Io Lines

426

HTS Kodu

8542.39.00.01

Montaj Tipi

Surface Mount

Ambalaj

Tray

Nem Hassasiyeti (MSL)

3 (168 Hours)

Qualification Status

Not Qualified

Part Aliases

972567

Shipping Restrictions

This product may require additional documentation to export from the United States.

Reflow Temperaturemax S

30

Parça Durumu

Obsolete

Maks. Oturma Yüksekliği

2.1mm

Terminal Adımı

1 mm

Temperature Grade

OTHER

Terminal Sayısı

672

Terminal Kaplaması

Tin/Lead (Sn63Pb37)

Besleme Gerilimi

1.8V

Çalışma Sıcaklığı

0°C ~ 85°C

Seated Heightmax

2.1 mm

Number Of Ios

426

Interface

EBI/EMI, UART/USART

Tepe Reflow Sıcaklığı (°C)

220

Fpga Core Cells

16640

Number Of Terminals

672