EPXA4F672C1

Specifications

Part Aliases

968767

Qualification Status

Not Qualified

Ambalaj

Tray

Nem Hassasiyeti (MSL)

3 (168 Hours)

Shipping Restrictions

This product may require additional documentation to export from the United States.

Reflow Temperaturemax S

30

Package Description

BGA,

Number Of Io Lines

426

HTS Kodu

8542.39.00.01

Montaj Tipi

Surface Mount

Seated Heightmax

2.1 mm

Çalışma Sıcaklığı

0°C ~ 85°C

Number Of Ios

426

Terminal Adımı

1 mm

Temperature Grade

OTHER

Maks. Oturma Yüksekliği

2.1mm

Parça Durumu

Obsolete

Terminal Kaplaması

TIN LEAD

Terminal Sayısı

672

Besleme Gerilimi

1.8V

Package Style

GRID ARRAY

Organization

0 DEDICATED INPUTS, 426 I/O

Terminal Formu

BALL

Üretici Parça No

EPXA4F672C1

Package Shape

SQUARE

Besleme Gerilimi

1.8V

Program Sram Bytes

128K

Package Body Material

PLASTIC/EPOXY

Jesd30 Code

S-PBGA-B672

Risk Rank

8.73

Data Sram Bytes

64K

Yüzey Montaj

YES

Tepe Reflow Süresi (maks. sn)

30

Ihs Manufacturer

INTEL CORP

Ürün Tipi

Programmable Logic IC Development Tools

Fpga Gates

400K

Speed

266MHz

Supply Voltagenom

1.8 V

Rohs Code

No

Moisture Sensitivity Levels

3