Volume pricing
- 1+ pcs$4.00
- 10+ pcs$4.00
- 25+ pcs$4.00
- 50+ pcs$4.00
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Style
- GRID ARRAY
- Package Code
- BGA
- Montaj Tipi
- Surface Mount, MLCC
- HTS Kodu
- 8542.39.00.01
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Rohs Code
- Yes
- Supply Voltagemin Vsup
- 0.87V
- Package Description
- BGA, BGA1152,34X34,40
- Ihs Manufacturer
- INTEL CORP
- Ram Size
- 256KB
- RoHS Durumu
- RoHS Compliant
- Package Equivalence Code
- BGA1152,34X34,40
- Yüzey Montaj
- YES
- Boyut / Ölçü
- 0.063 L x 0.031 W (1.60mm x 0.80mm)
- Seri
- GA
- Applications
- Automotive
- Terminal Formu
- BALL
- Supply Voltagemax Vsup
- 0.93V
- Power Supplies
- 0.9 V
- Number Of Terminals
- 1152
- Parça Durumu
- Active
- Architecture
- MCU, FPGA
- Maks. Kalınlık
- 0.038 (0.97mm)
- Fabrika Tedarik Süresi
- 8 Weeks
- Reflow Temperaturemax S
- NOT SPECIFIED
- Package Body Material
- PLASTIC/EPOXY
- Jesd30 Code
- S-PBGA-B1152
- Temperature Grade
- OTHER
- Peripherals
- DMA, POR, WDT
- Number Of Inputs
- 492
- Package Shape
- SQUARE
- Paket
- Tape & Reel (TR)
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Maks. Oturma Yüksekliği
- 3.65mm
- Ambalaj
- Tray
- Tolerans
- ±0.5pF
- Risk Rank
- 5.45
- Ürün Durumu
- Obsolete
- Uzunluk
- 35 mm
- Qualification Status
- Not Qualified