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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Number Of Inputs
- 396
- Package Shape
- SQUARE
- Paket
- Bulk
- Peripherals
- DMA, POR, WDT
- Maks. Oturma Yüksekliği
- 3.5mm
- Power Peak Pulse
- 5000W (5kW)
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Voltage Breakdown Min
- 14.4V
- Jesd30 Code
- S-PBGA-B1152
- Temperature Grade
- INDUSTRIAL
- Fabrika Tedarik Süresi
- 12 Weeks
- Reflow Temperaturemax S
- NOT SPECIFIED
- Package Body Material
- PLASTIC/EPOXY
- Uzunluk
- 35 mm
- Current Peak Pulse101000s
- 233A
- Qualification Status
- Not Qualified
- Ambalaj
- Tray
- Risk Rank
- 5.45
- Ürün Durumu
- Last Time Buy
- Package Description
- BGA, BGA1152,34X34,40
- Rohs Code
- Yes
- Supply Voltagemin Vsup
- 0.87V
- Ram Size
- 256KB
- Ihs Manufacturer
- INTEL CORP
- Tip
- Zener
- Package Code
- BGA
- Package Style
- GRID ARRAY
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Montaj Tipi
- Through Hole
- HTS Kodu
- 8542.39.00.01
- Terminal Formu
- BALL
- Voltage Clamping Max Ipp
- 21.5V
- Architecture
- MCU, FPGA
- Parça Durumu
- Active
- Supply Voltagemax Vsup
- 0.93V
- Number Of Terminals
- 1152
- Power Supplies
- 0.9 V
- Package Equivalence Code
- BGA1152,34X34,40
- Yüzey Montaj
- YES
- RoHS Durumu
- RoHS Compliant