Volume pricing
- 1+ pcs$3.00
- 10+ pcs$3.00
- 25+ pcs$3.00
- 50+ pcs$3.00
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Code
- BGA
- Package Style
- GRID ARRAY
- HTS Kodu
- 8542.39.00.01
- Rohs Code
- Yes
- Package Description
- BGA, BGA1152,34X34,40
- Number Of Logic Elements
- 570000 LE
- Ihs Manufacturer
- INTEL CORP
- Ram Size
- 256KB
- Yüzey Montaj
- YES
- Package Equivalence Code
- BGA1152,34X34,40
- Seri
- *
- Terminal Formu
- BALL
- Shipping Restrictions
- This product may require additional documentation to export from the United States.
- Power Supplies
- 0.9 V
- Number Of Terminals
- 1152
- Parça Durumu
- Active
- Architecture
- MCU, FPGA
- Maximum Clock Frequency
- 1.2 GHz
- Package Body Material
- PLASTIC/EPOXY
- Reflow Temperaturemax S
- NOT SPECIFIED
- Jesd30 Code
- S-PBGA-B1152
- Temperature Grade
- OTHER
- Peripherals
- DMA, POR, WDT
- Number Of Inputs
- 492
- Package Shape
- SQUARE
- Paket
- Bulk
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Risk Rank
- 5.45
- Ambalaj
- Tray
- Ürün Durumu
- Active
- Uzunluk
- 35 mm
- Number Of Logic Array Blocks Labs
- 71250 LAB
- Qualification Status
- Not Qualified
- Fabrika Paket Adedi
- 24
- Supply Voltagemax
- 0.93 V
- Connectivity
- EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Kılıf / Paket
- 1152-BBGA, FCBGA
- Primary Attributes
- FPGA - 570K Logic Elements
- Number Of Cores
- 2 Core
- L1 Cache Instruction Memory
- 2 x 32 kB