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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Supply Voltagemin Vsup
- 0.87V
- Rohs Code
- Yes
- Package Description
- BGA, BGA1152,34X34,40
- Number Of Logic Elements
- 480000 LE
- Ihs Manufacturer
- INTEL CORP
- Ram Size
- 256KB
- Package Code
- BGA
- Package Style
- GRID ARRAY
- Montaj Tipi
- Surface Mount, MLCC
- HTS Kodu
- 8542.39.00.01
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Shipping Restrictions
- This product may require additional documentation to export from the United States.
- Terminal Formu
- BALL
- Supply Voltagemax Vsup
- 0.93V
- Number Of Terminals
- 1152
- Power Supplies
- 0.9 V
- Architecture
- MCU, FPGA
- Parça Durumu
- Active
- RoHS Durumu
- RoHS Compliant
- Yüzey Montaj
- YES
- Package Equivalence Code
- BGA1152,34X34,40
- Boyut / Ölçü
- 0.177 L x 0.126 W (4.50mm x 3.20mm)
- Seri
- GA
- Applications
- Automotive
- Peripherals
- DMA, POR, WDT
- Number Of Inputs
- 396
- Package Shape
- SQUARE
- Paket
- Tape & Reel (TR)
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Maks. Oturma Yüksekliği
- 3.5mm
- Maks. Kalınlık
- 0.086 (2.18mm)
- Maximum Clock Frequency
- 1.2 GHz
- Reflow Temperaturemax S
- NOT SPECIFIED
- Package Body Material
- PLASTIC/EPOXY
- Jesd30 Code
- S-PBGA-B1152
- Temperature Grade
- OTHER
- Uzunluk
- 35 mm
- Qualification Status
- Not Qualified
- Number Of Logic Array Blocks Labs
- 60000 LAB
- Temperature Coefficient
- C0G, NP0