Volume pricing
- 1+ pcs$3.00
- 10+ pcs$3.00
- 25+ pcs$3.00
- 50+ pcs$3.00
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- RoHS Durumu
- RoHS Compliant
- Package Equivalence Code
- BGA1152,34X34,40
- Yüzey Montaj
- YES
- Boyut / Ölçü
- 0.063 L x 0.031 W (1.60mm x 0.80mm)
- Seri
- SG73
- Terminal Formu
- BALL
- Shipping Restrictions
- This product may require additional documentation to export from the United States.
- Supply Voltagemax Vsup
- 0.93V
- Number Of Terminals
- 1152
- Power Supplies
- 0.9 V
- Architecture
- MCU, FPGA
- Parça Durumu
- Active
- Package Code
- BGA
- Package Style
- GRID ARRAY
- HTS Kodu
- 8542.39.00.01
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Supply Voltagemin Vsup
- 0.87V
- Rohs Code
- Yes
- Package Description
- BGA, BGA1152,34X34,40
- Number Of Logic Elements
- 480000 LE
- Ihs Manufacturer
- INTEL CORP
- Ram Size
- 256KB
- Risk Rank
- 5.47
- Tolerans
- ±20%
- Ambalaj
- Tray
- Ürün Durumu
- Active
- Uzunluk
- 35 mm
- Number Of Logic Array Blocks Labs
- 60000 LAB
- Qualification Status
- Not Qualified
- Temperature Coefficient
- ±200ppm/°C
- Maximum Clock Frequency
- 1.2 GHz
- Package Body Material
- PLASTIC/EPOXY
- Reflow Temperaturemax S
- NOT SPECIFIED
- Fabrika Tedarik Süresi
- 11 Weeks
- Composition
- Thick Film
- Jesd30 Code
- S-PBGA-B1152
- Temperature Grade
- INDUSTRIAL
- Peripherals
- DMA, POR, WDT
- Package Shape
- SQUARE
- Number Of Inputs
- 492