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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Maks. Oturma Yüksekliği
- 0.022 (0.55mm)
- Peripherals
- DMA, POR, WDT
- Number Of Inputs
- 360
- Package Shape
- SQUARE
- Paket
- Tape & Reel (TR)
- Fabrika Tedarik Süresi
- 8 Weeks
- Reflow Temperaturemax S
- NOT SPECIFIED
- Package Body Material
- PLASTIC/EPOXY
- Jesd30 Code
- S-PBGA-B780
- Composition
- Thin Film
- Temperature Grade
- INDUSTRIAL
- Maximum Clock Frequency
- 1.2 GHz
- Number Of Logic Array Blocks Labs
- 60000 LAB
- Qualification Status
- Not Qualified
- Temperature Coefficient
- ±10ppm/°C
- Uzunluk
- 29 mm
- Ambalaj
- Tray
- Tolerans
- ±0.1%
- Risk Rank
- 5.49
- Ürün Durumu
- Obsolete
- Ihs Manufacturer
- INTEL CORP
- Ram Size
- 256KB
- Rohs Code
- Yes
- Supply Voltagemin Vsup
- 0.87V
- Package Description
- BGA, BGA780,28X28,40
- Number Of Logic Elements
- 480000 LE
- HTS Kodu
- 8542.39.00.01
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- Package Style
- GRID ARRAY
- Package Code
- BGA
- Supply Voltagemax Vsup
- 0.93V
- Number Of Terminals
- 780
- Power Supplies
- 0.9 V
- Parça Durumu
- Active
- Architecture
- MCU, FPGA
- Shipping Restrictions
- This product may require additional documentation to export from the United States.
- Terminal Formu
- BALL
- Seri
- RN73
- Boyut / Ölçü
- 0.063 L x 0.031 W (1.60mm x 0.80mm)