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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Code
- BGA
- Package Style
- GRID ARRAY
- Nem Hassasiyeti (MSL)
- 3 (168 Hours)
- HTS Kodu
- 8542.39.00.01
- Package Description
- BGA, BGA780,28X28,40
- Supply Voltagemin Vsup
- 0.87V
- Rohs Code
- Yes
- Ram Size
- 256KB
- Ihs Manufacturer
- INTEL CORP
- Yüzey Montaj
- YES
- Package Equivalence Code
- BGA780,28X28,40
- RoHS Durumu
- RoHS Compliant
- Seri
- *
- Terminal Formu
- BALL
- Architecture
- MCU, FPGA
- Parça Durumu
- Active
- Power Supplies
- 0.9 V
- Number Of Terminals
- 780
- Supply Voltagemax Vsup
- 0.93V
- Temperature Grade
- OTHER
- Jesd30 Code
- S-PBGA-B780
- Package Body Material
- PLASTIC/EPOXY
- Reflow Temperaturemax S
- NOT SPECIFIED
- Fabrika Tedarik Süresi
- 8 Weeks
- Paket
- Bag
- Package Shape
- SQUARE
- Number Of Inputs
- 360
- Peripherals
- DMA, POR, WDT
- Maks. Oturma Yüksekliği
- 3.35mm
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Ürün Durumu
- Active
- Risk Rank
- 5.47
- Ambalaj
- Tray
- Uzunluk
- 29 mm
- Qualification Status
- Not Qualified
- Supply Voltagemax
- 0.93 V
- Primary Attributes
- FPGA - 480K Logic Elements
- Connectivity
- EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Kılıf / Paket
- 780-BBGA, FCBGA
- Terminal Sayısı
- 780