10AS022E3F27I1SG

Specifications

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Besleme Gerilimi

0.9V

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Ram Size

256KB

Yüzey Montaj

YES

Package Style

GRID ARRAY

Özellikler

Moisture Resistant

Rohs Code

Yes

Power Supplies

0.9 V

Nem Hassasiyeti (MSL)

3 (168 Hours)

Çalışma Sıcaklığı

-55°C ~ 155°C

REACH Uyumluluk Kodu

compliant

Package Description

27 X 27 MM, ROHS COMPLIANT, FBGA-672

Terminal Adımı

1 mm

Temel Ürün No

RN731J

Supply Voltagemin

0.87 V

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Number Of Ios

240

Tolerans

±0.1%

Part Life Cycle Code

Obsolete

Terminal Sayısı

2

Boyut / Ölçü

0.063 L x 0.031 W (1.60mm x 0.80mm)

Package Code

BGA

Number Of Terminals

672

Package Body Material

PLASTIC/EPOXY

Number Of Outputs

240

Speed

1.5GHz

RoHS

Non-Compliant

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Maks. Oturma Yüksekliği

0.022 (0.55mm)

Architecture

MCU, FPGA

Temperature Coefficient

±50ppm/°C

Supply Voltagemin Vsup

0.87V

Üretici Parça No

10AS022E3F27I1SG

Paket

Tape & Reel (TR)

Ambalaj

Tray

Number Of Inputs

240

Reflow Temperaturemax S

NOT SPECIFIED

Composition

Thin Film

Package Shape

SQUARE