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C3 ChipZentronix
7130DG

Aavid, Thermal Division of Boyd Corporation

7130DG

Heat Sinks

In StockRoHS: Compliant

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Same-day dispatch from stock

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RoHS

Compliant

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Specifications

RoHS Durumu
RoHS Compliant
Material Finish
Tin
Kurşunsuz
Lead Free
Kılıf / Paket
TO-218
Yükseklik
15.49mm
Yayın Yılı
2007
Power Dissipation Temperature Rise
0.5W @ 20°C
Uzunluk
1.025 26.04mm
Thermal Resistance Forced Air Flow
4.00°C/W @ 500 LFM
Shape
Rectangular, Fins
Nem Hassasiyeti (MSL)
Not Applicable
Depth
15.49mm
Parça Durumu
Active
Thermal Resistance Natural
23.10°C/W
Tip
Board Level, Vertical
Package Cooled
TO-218
Attachment Method
Clip and PC Pin
Body Material
Copper
Genişlik
1.005 25.53mm
Height Off Base Height Of Fin
0.610 15.49mm
Montaj
Clip, PC Pin
Fabrika Tedarik Süresi
9 Weeks
Material
Copper

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