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C3 ChipZentronix
573400D00000G

Aavid, Thermal Division of Boyd Corporation

573400D00000G

Heat Sinks

In StockRoHS: Compliant

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Same-day dispatch from stock

Genuine parts

Verified sourcing

RoHS

Compliant

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Technical team support

Specifications

Depth
12.7mm
Genişlik
1.220 30.99mm
Yükseklik
10mm
Package Cooled
TO-268 (D3Pak)
Kılıf / Paket
TO-268
Contact Plating
Tin
Shape
Rectangular, Fins
Montaj
Surface Mount
Thermal Resistance Natural
14.00°C/W
Yayın Yılı
2006
Fabrika Tedarik Süresi
7 Weeks
Tip
Top Mount
Thermal Resistance Forced Air Flow
4.00°C/W @ 600 LFM
Material Finish
Tin
Attachment Method
SMD Pad
Power Dissipation Temperature Rise
1.0W @ 20°C
Renk
Black
Parça Durumu
Active
Reach Svhc
No SVHC
RoHS Durumu
RoHS Compliant
Uzunluk
0.500 12.70mm
Height Off Base Height Of Fin
0.401 10.20mm
Nem Hassasiyeti (MSL)
Not Applicable

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