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C3 ChipZentronix
573300D00000G

Aavid, Thermal Division of Boyd Corporation

573300D00000G

Heat Sinks

In StockRoHS: Compliant
Volume pricing
  • 1+ pcs$1.02
  • 10+ pcs$0.96
  • 100+ pcs$0.91
  • 500+ pcs$0.86

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Same-day dispatch from stock

Genuine parts

Verified sourcing

RoHS

Compliant

Support

Technical team support

Specifications

Kılıf / Paket
TO-263
Ambalaj
Box
Shape
Rectangular, Fins
Thermal Resistance Natural
18.00°C/W
Tip
Top Mount
Fabrika Tedarik Süresi
7 Weeks
Yayın Yılı
2007
Material Finish
Tin
Attachment Method
SMD Pad
Uzunluk
0.500 12.70mm
Nem Hassasiyeti (MSL)
Not Applicable
Height Off Base Height Of Fin
0.400 10.16mm
Genişlik
1.030 26.16mm
Depth
12.7mm
Yükseklik
10.16mm
Kurşunsuz
Lead Free
Package Cooled
TO-263 (D2Pak)
Contact Plating
Tin
Montaj
Surface Mount
Radyasyon Dayanımı
No
Thermal Resistance Forced Air Flow
8.00°C/W @ 300 LFM
Material
Aluminum
Power Dissipation Temperature Rise
1.3W @ 30°C
Parça Durumu
Active
Reach Svhc
No SVHC
RoHS Durumu
RoHS Compliant

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