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C3 ChipZentronix
374324B60023G

Aavid, Thermal Division of Boyd Corporation

374324B60023G

Heat Sinks

RoHS: Compliant

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Compliant

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Specifications

Seri
37432
Material Finish
Black Anodized
Montaj
Solder
Fabrika Tedarik Süresi
8 Weeks
Package Cooled
BGA, FPGA
Radyasyon Dayanımı
No
Thermal Resistance Forced Air Flow
6.00°C/W @ 500 LFM
Depth
27mm
Yayın Yılı
2002
Genişlik
1.063 27.00mm
Yükseklik
10mm
Kılıf / Paket
BGA
Uzunluk
1.063 27.00mm
Shape
Square, Pin Fins
Material
Aluminum
Height Off Base Height Of Fin
0.394 10.00mm
Renk
Silver
Attachment Method
Solder Anchor
Thermal Resistance Natural
30.60°C/W
Power Dissipation Temperature Rise
1.5W @ 50°C
Tip
Board Level
Parça Durumu
Active
Kurşunsuz
Lead Free
Reach Svhc
No SVHC
RoHS Durumu
RoHS Compliant
Nem Hassasiyeti (MSL)
Not Applicable

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