X5701WV-03-LPSW

Teknik Özellikler

Ambalaj

Bag

Package Form

DIP

Pin Structure

1x3

Additional Description

Line to board/line to line connector

Operation

Vertical

Number Of Pinsrow

3

Industry Standards

UL/CUL-E523734

Contact Materials

High conductive Brass

Reference Series

MX 5.7

Connector Type

Female Socket

Mating Type

X5701H-03-N0,X5701T-BSN,X5701T-BSN-H,X5701T-BSN-M

Contact Plating

Tin

Ürün Tipi

Wire-to-Board Connector

Package Specification

DIP,P=5.7mm

Jack Structure

1x03

Renk

Black

Mounting

Through-hole Mount

Production Status

Active

Mpq

500 piece/bag

Sıra Sayısı

Single row

Pitch

5.7mm

Seri

Wire to board 5.7-X5701

Rated Current

23A

With Latch

Yes