Sevkiyat
Stoktan aynı gün hazırlık
Orijinal ürün
Doğrulanmış tedarik
RoHS
Compliant
Destek
Teknik ekip desteği
Teknik Özellikler
- Yüzey Montaj
- YES
- Package Body Material
- UNSPECIFIED
- Package Style
- CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
- Uzunluk
- 3.9 mm
- Genişlik
- 2.9 mm
- Package Shape
- RECTANGULAR
- Part Life Cycle Code
- Active
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Supply Voltagenom
- 3 V
- Number Of Terminals
- 20
- Kurşunsuz Kodu
- Yes
- REACH Uyumluluk Kodu
- unknown
- Fonksiyon Sayısı
- 1
- Supply Currentmax
- 180 mA
- Telecom Ic Type
- CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Package Code
- HVBCC
- Terminal Adımı
- 0.5 mm
- Ihs Manufacturer
- TOSHIBA CORP
- Terminal Pozisyonu
- BOTTOM
- Package Description
- HVBCC,
- Temperature Grade
- INDUSTRIAL
- Jesd30 Code
- R-XBCC-B20
- Terminal Formu
- BUTT
- HTS Kodu
- 8542.39.00.01
- Seated Heightmax
- 0.53 mm
- Rohs Code
- Yes
- Qualification Status
- Not Qualified
- Operating Temperaturemax
- 85 °C
- Operating Temperaturemin
- -40 °C
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