BQ30Z554DBTR

Teknik Özellikler

Kılıf / Paket

30-TFSOP (0.173, 4.40mm Width)

Material Finish

Blue Anodized

Thermal Resistance Forced Air Flow

7.19°C/W @ 100 LFM

Paket

Bulk

Attachment Method

Push Pin

Ürün Durumu

Active

Çalışma Sıcaklığı

-40°C ~ 85°C (TA)

Shape

Square, Fins

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Fault Protection

Over Voltage

Interface

SMBus

Height Off Base Height Of Fin

1.378 (35.00mm)

Tip

Top Mount

Parça Durumu

Active

Seri

pushPIN™

Uzunluk

1.181 (30.00mm)

Material

Aluminum

Function

Fuel Gauge

Montaj Tipi

Surface Mount

Number Of Cells

2 ~ 4

Tedarikçi Cihaz Paketi

30-TSSOP

Genişlik

1.181 (30.00mm)