354072-E

Teknik Özellikler

Style

Board to Board

Housing Material

Liquid Crystal Polymer (LCP)

Sıra Sayısı

2

Maximum Data Rate

3 Gbps

Minimum Operating Temperature

- 55 C

Seri

SMC

Insulation Color

Black

Row Spacing Mating

0.050 (1.27mm)

Pitch

1.27 mm

Contact Finish Post

Tin

Maks. Çalışma Sıcaklığı

+ 125 C

Contact Materials

Copper Alloy

Stack Height

13.65 mm

Mounting Angle

Vertical

Contact Type

Female Socket

Terminal

Solder

Connector Type

Receptacle

Contact Shape

Square

Özellikler

Board Guide, Pick and Place, Solder Retention

Terminal Stili

Solder

Çalışma Sıcaklığı

-55°C ~ 125°C

Insulation Height

0.537 (13.64mm)

Pozisyon Sayısı

32

Paket

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Ürün Durumu

Active

Contact Finish Mating

Gold

Contact Finish Thickness Post

157.5µin (4.00µm)

Material Flammability Rating

UL94 V-0

Pitch Mating

0.050 (1.27mm)

Insulation Materials

Liquid Crystal Polymer (LCP)

Montaj Tipi

Surface Mount

Contact Plating

Gold

Akım Değeri

1.7 A

Current Rating Amps

1.7A per Contact

Number Of Positions Loaded

All

Fastening Type

Push-Pull