244839-E

Teknik Özellikler

Akım Değeri

1 A

Ürün Durumu

Active

Row Spacing Mating

0.050 (1.27mm)

Style

Board to Board

Contact Finish Post

Tin

Contact Materials

Copper Alloy

Insulation Color

Black

Paket

Tape & Reel (TR);Cut Tape (CT);

Terminal

Solder

Connector Type

Header

Pozisyon Sayısı

68

Seri

SMC

Current Rating Amps

1.7A per Contact

Insulation Height

0.266 (6.76mm)

Stack Height

1.75 mm

Fastening Type

Push-Pull

Terminal Stili

Solder

Contact Finish Thickness Post

157.5µin (4.00µm)

Maximum Data Rate

3 Gbps

Maks. Çalışma Sıcaklığı

+ 125 C

Sıra Sayısı

2

Contact Lengthmating

0.157 (4.00mm)

Insulation Materials

Liquid Crystal Polymer (LCP)

Pitch

1.27 mm

Shrouding

Shrouded - 4 Wall

Material Flammability Rating

UL94 V-0

Housing Material

Liquid Crystal Polymer (LCP)

Pitch Mating

0.050 (1.27mm)

Montaj Tipi

Surface Mount

Contact Plating

Gold

Özellikler

Board Guide, Pick and Place, Solder Retention

Contact Finish Mating

Gold

Minimum Operating Temperature

- 55 C

Contact Type

Male Pin

Çalışma Sıcaklığı

-55°C ~ 125°C

Contact Shape

Square

Mounting Angle

Vertical

Number Of Positions Loaded

All