234201-E

Teknik Özellikler

Özellikler

Board Guide, Pick and Place, Solder Retention

Minimum Operating Temperature

- 55 C

Contact Shape

Square

Row Spacing Mating

0.050 (1.27mm)

Maks. Çalışma Sıcaklığı

+ 125 C

Insulation Materials

Liquid Crystal Polymer (LCP)

Maximum Data Rate

3 Gbps

Pozisyon Sayısı

80

Current Rating Amps

1.7A per Contact

Contact Materials

Copper Alloy

Contact Plating

Gold

Pitch Mating

0.050 (1.27mm)

Fastening Type

Push-Pull

Paket

Tape & Reel (TR);Cut Tape (CT);

Style

Board to Board

Contact Finish Thickness Post

157.5µin (4.00µm)

Ürün Durumu

Active

Montaj Tipi

Surface Mount

Housing Material

Liquid Crystal Polymer (LCP)

Pitch

1.27 mm

Insulation Color

Black

Mounting Angle

Vertical

Insulation Height

0.537 (13.64mm)

Stack Height

13.65 mm

Seri

SMC

Akım Değeri

1 A

Contact Type

Female Socket

Connector Type

Receptacle

Contact Finish Post

Tin

Çalışma Sıcaklığı

-55°C ~ 125°C

Sıra Sayısı

2

Contact Finish Mating

Gold

Terminal Stili

Solder

Terminal

Solder

Number Of Positions Loaded

All

Material Flammability Rating

UL94 V-0