Sevkiyat
Stoktan aynı gün hazırlık
Orijinal ürün
Doğrulanmış tedarik
RoHS
Compliant
Destek
Teknik ekip desteği
Teknik Özellikler
- Number Of Positionsu2009
- 3647
- Termination Method
- Solder Pot
- Package Type
- LGA
- Ürün Tipi
- IC & Component Sockets
- Body Orientation
- Straight
- Product Length Mm
- 84(mm)
- Terminal Stili
- Solder Ball
- Te Internal Description
- LGA3647-1 SOCKET-P1 KIT FOR ODM (30U AU)
- Maks. Çalışma Sıcaklığı
- + 100 C
- Minimum Operating Temperature
- - 25 C
- Insulation Materials
- Thermoplastic
- Centerline Pitchu2009mm
- .86, .99
- Ambalaj
- Tray
- Schedule B
- 8536694040/8536694040/8536694040/8536694040/8536694040
- Product Depth Mm
- 64(mm)
- Insulation Resistance
- 500(Mohm)
- Contact Materials
- Copper Alloy
- Circuit Applications
- Signal
- Pozisyon Sayısı
- 3647
- Rad Hardened
- No
- Centerline Pitchu2009in
- .034, .039
- Lifecycle Status
- Production (Last Updated: 3 days ago)
- Housing Color
- Black
- Fabrika Paket Adedi
- 12
- Operating Temp Range
- -25C to 100C
- Connector Systemu2009
- Board-to-Board
- Contact Plating
- Gold Over Nickel
- Contact Mating Area Plating Material Thicknessu2009in
- 30
- Plating
- Gold
- Ic Socket Typeu2009
- LGA 3647
- Te Internal
- 2-2822979-4
- Voltage Rating
- 500 VDC
- RoHS
- Non-Compliant
- Pitch
- 0.85mm
- Gender
- SKT
- Montaj
- Solder, Surface Mount
- Housing Material
- Thermoplastic
- Tip
- LGA Socket
- Number Of Contacts
- 3647(POS)
- Flammability Rating
- UL94 V-0
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