AMC55MMSD

Teknik Özellikler

Connector Type

SO-DIMM-200

Sıra Sayısı

2

Moduleboard Type

MPU, FPGA Core

Terminal

Solder

Contact Finish Thickness

30.0µin (0.76µm)

Pozisyon Sayısı

110

Material Insulation

Polyphenylene Sulfide (PPS)

Temel Ürün No

AMC55

Core Processor

Spartan-6, XC6SLX16

Çalışma Sıcaklığı

-40°C ~ 85°C

Seri

MitySOM

Paket

Bulk

Flange Feature

Flush Mount, Side Opening, Unthreaded, 0.125 (3.18mm) Dia

Contact Finish

Gold

Ürün Durumu

Obsolete

Card Type

Fits Female Edgecards

Read Out

Dual

Flash Size

256MB (NAND), 8MB (NOR)

Pitch

0.100 (2.54mm)

Boyut / Ölçü

2.660 L x 2.000 W (67.60mm x 50.80mm)

Coprocessor

Spartan-6, XC6SLX16

Ram Size

8kB (Internal), 128MB (External)

Speed

375MHz

Number Of Positionsbayrow

55

Gender

Male

Contact Materials

Beryllium Copper