373

Teknik Özellikler

Material

Aluminum

Contact Materials

Glass

Montaj

Vertical

Proto Board Type

Breadboard, Prepunched Insulating

Thermal Resistance Forced Air Flow

5.95°C/W @ 100 LFM

Height Off Base Height Of Fin

0.590 (15.00mm)

Hole Diameter

0.038 (0.97mm)

Tip

Top Mount

Boyut / Ölçü

4.39Lx2.28W 111.5mmx57.9mm

RoHS Durumu

RoHS Compliant

Seri

pushPIN™

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Genişlik

1.969 (50.00mm)

Parça Durumu

Active

Attachment Method

Push Pin

Plating

Non-Plated Through Hole (NPTH)

Shape

Square, Fins

Nem Hassasiyeti (MSL)

Not Applicable

Board Thickness

0.062 1.58mm

Uzunluk

1.969 (50.00mm)

Material Finish

Blue Anodized

Pitch

0.100 2.54mm