SM662QXCACSP1212

Teknik Özellikler

Cell Type

MLC NAND

Package Height

1.2

Mounting

Surface Mount

Hts

8542.32.00.71

Pin Sayısı

169

Maximum Operating Temperature C

85

Package Width

12

Minimum Operating Temperature C

-25

Programmability

Yes

Standard Package Name

BGA

Support Of Page Mode

No

Interface Type

Serial e-MMC

Lead Shape

Ball

Timing Type

Synchronous

Automotive

Yes

Command Compatible

Yes

Eccn Us

3A991.b.1.a

Ecc Support

Yes

Chip Density Bit

512G

Package Length

16

Supplier Package

BGA

Supplier Temperature Grade

Commercial

Parça Durumu

Unconfirmed

Eu Rohs

Compliant

Boot Block

No

Ppap

Unknown

Pcb Changed

169