MD3331-D64-V3-X-P

Teknik Özellikler

Package Body Material

PLASTIC/EPOXY

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

REACH Uyumluluk Kodu

unknown

Terminal Adımı

0.8 mm

Supply Voltagenom

3.3 V

Terminal Pozisyonu

BOTTOM

Supply Voltagemin

2.7 V

Pin Sayısı

69

Host Data Transfer Ratemax

20 MBps

Uzunluk

12 mm

Package Code

LFBGA

Seated Heightmax

1.5 mm

Operating Temperaturemin

-40 °C

Number Of Terminals

69

Host Interface Standard

ISA

Ihs Manufacturer

SANDISK CORP

HTS Kodu

8542.31.00.01

Terminal Formu

BALL

External Data Bus Width

16

Part Life Cycle Code

Obsolete

Operating Temperaturemax

85 °C

Part Package Code

BGA

Package Description

LFBGA,

Supply Voltagemax

3.6 V

Temperature Grade

INDUSTRIAL

Upsucsperipheral Ics Type

SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

Yüzey Montaj

YES

Package Shape

RECTANGULAR

Genişlik

9 mm

Jesd30 Code

R-PBGA-B69