KFG1216U2A-DIB6

Teknik Özellikler

Operating Temperaturemin

-40 °C

Memory Density

536870912 bit

Qualification Status

Not Qualified

Package Code

FBGA

Yüzey Montaj

YES

Supply Currentmax

0.04 mA

Command User Interface

YES

Number Of Words

33554432 words

Access Timemax

11.5 ns

Package Body Material

PLASTIC/EPOXY

Moisture Sensitivity Levels

1

Number Of Sectorssize

512

Standby Currentmax

0.00008 A

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Operating Temperaturemax

85 °C

Rohs Code

Yes

Number Of Words Code

32000000

Number Of Terminals

63

Kurşunsuz Kodu

Yes

Page Size

1K words

JESD-609 Kodu

e3

Data Polling

NO

ECCN Kodu

EAR99

Jesd30 Code

R-PBGA-B63

Sector Size

64K

Terminal Adımı

0.8 mm

Toggle Bit

NO

Package Style

GRID ARRAY, FINE PITCH

Terminal Formu

BALL

Temperature Grade

INDUSTRIAL

Part Life Cycle Code

Obsolete

Organization

32MX16

Supply Voltagenom Vsup

3.3 V

Package Equivalence Code

BGA63,10X12,32

Memory Width

16

HTS Kodu

8542.32.00.51

Terminal Pozisyonu

BOTTOM

Terminal Kaplaması

MATTE TIN

Memory Ic Type

FLASH

Package Shape

RECTANGULAR