XPC745BPX350LD

Teknik Özellikler

Speed

350 MHz

Package Body Material

PLASTIC/EPOXY

Package Description

BGA,

Package Style

GRID ARRAY

Supply Voltagenom

2 V

REACH Uyumluluk Kodu

unknown

Terminal Formu

BALL

Part Life Cycle Code

Active

Supply Voltagemax

2.1 V

Package Code

BGA

Upsucsperipheral Ics Type

MICROPROCESSOR, RISC

Integrated Cache

NO

HTS Kodu

8542.31.00.01

Yüzey Montaj

YES

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Shape

RECTANGULAR

Boundary Scan

YES

Number Of Terminals

255

Terminal Pozisyonu

BOTTOM

Low Power Mode

NO

Jesd30 Code

R-PBGA-B255

Format

FIXED POINT

Supply Voltagemin

1.9 V