Sevkiyat
Stoktan aynı gün hazırlık
Orijinal ürün
Doğrulanmış tedarik
RoHS
Compliant
Destek
Teknik ekip desteği
Teknik Özellikler
- Rohs Code
- No
- Moisture Sensitivity Levels
- 3
- Jtag Bst
- YES
- Additional Feature
- 128 MACROCELLS
- Package Style
- FLATPACK, THIN PROFILE, FINE PITCH
- Package Description
- TFQFP,
- JESD-609 Kodu
- e0
- Tepe Reflow Süresi (maks. sn)
- 30
- Part Package Code
- QFP
- Tepe Reflow Sıcaklığı (°C)
- 240
- Part Life Cycle Code
- Transferred
- Insystem Programmable
- YES
- Seated Heightmax
- 1.2 mm
- Pin Sayısı
- 100
- Supply Voltagemin
- 3 V
- Qualification Status
- Not Qualified
- Supply Voltagenom
- 3.3 V
- Package Code
- TFQFP
- Operating Temperaturemax
- 85 °C
- Package Equivalence Code
- TQFP100,.63SQ
- REACH Uyumluluk Kodu
- unknown
- Propagation Delay
- 17.5 ns
- Operating Temperaturemin
- -40 °C
- Output Function
- MACROCELL
- HTS Kodu
- 8542.39.00.01
- Yüzey Montaj
- YES
- Package Shape
- SQUARE
- Number Of Terminals
- 100
- Terminal Kaplaması
- Tin/Lead (Sn/Pb)
- Organization
- 2 DEDICATED INPUTS, 80 I/O
- Jesd30 Code
- S-PQFP-G100
- Package Body Material
- PLASTIC/EPOXY
- Number Of Io Lines
- 80
- Terminal Pozisyonu
- QUAD
- Uzunluk
- 14 mm
- Supply Voltagemax
- 3.6 V
- Clock Frequencymax
- 59 MHz
- Packing Method
- TRAY
- Terminal Formu
- GULL WING
- Ihs Manufacturer
- NXP SEMICONDUCTORS