1PS79SB30

Teknik Özellikler

Tepe Reflow Sıcaklığı (°C)

260

JESD-609 Kodu

e3

Package Description

ULTRA SMALL, PLASTIC, SC-79, 2 PIN

Number Of Elements

1

Package Style

SMALL OUTLINE

Yükseklik

18mm

Number Of Phases

1

Forward Voltagemax Vf

0.22 V

Nonrep Pk Forward Currentmax

1 A

Genişlik

12mm

Tepe Reflow Süresi (maks. sn)

30

Plate Thickness

3.6mm

Rep Pk Reverse Voltagemax

40 V

Type Of Heatsink

extruded

Package Body Material

PLASTIC/EPOXY

Jesd30 Code

R-PDSO-F2

Risk Rank

1.16

Terminal Kaplaması

Tin (Sn)

Operating Temperaturemax

150 °C

Terminal Formu

FLAT

Material Finishing

raw

Material

aluminium

Package Shape

RECTANGULAR

Üretici Parça No

1PS79SB30

Exterior Housing Material

1

REACH Uyumluluk Kodu

compliant

Qualification Status

Not Qualified

Ihs Manufacturer

NXP SEMICONDUCTORS

Configuration

SINGLE

Diode Type

RECTIFIER DIODE

Diode Element Material

SILICON

Yüzey Montaj

YES

Output Currentmax

0.2 A

2nd Connector Number Of Positions Loaded

universal

Gross Weight

700 g

Terminal Pozisyonu

DUAL

Reflow Temperaturemax S

30

Saturation Current

1

Kurşunsuz Kodu

Yes

Mounting

for back plate