M2S025TS-1FCSG325I

Teknik Özellikler

Number Of Logic Elements

27696 LE

Nem Hassasiyeti (MSL)

3 (168 Hours)

Technology

CMOS

Kılıf / Paket

325-TFBGA, CSPBGA

Connectivity

CANbus, Ethernet, I2C, SPI, UART/USART, USB

Ihs Manufacturer

MICROSEMI CORP

Flash Size

256KB

Fabrika Paket Adedi

176

Montaj Stili

SMD/SMT

Package Equivalence Code

BGA325,21X21,20

Additional Feature

LG-MIN, WD-MIN

Peripherals

DDR, PCIe, SERDES

Lifecycle Status

IN PRODUCTION (Last Updated: 2 weeks ago)

Üretici Parça No

M2S025TS-1FCSG325I

Primary Attributes

FPGA - 25K Logic Modules

Maximum Clock Frequency

166 MHz

JESD-609 Kodu

e3

Supply Voltagemax

1.26 V

Çalışma Sıcaklığı

-40°C~100°C TJ

Number Of Outputs

180

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Package Code

TFBGA

Number Of Logic Cells

27696

Yayın Yılı

2015

Besleme Gerilimi

1.2V

Terminal Pozisyonu

BOTTOM

Terminal Sayısı

325

Ürün Durumu

Active

Core Processor

ARM® Cortex®-M3

Fabrika Tedarik Süresi

10 Weeks

Rohs Code

Yes

Shipping Restrictions

This product may require additional documentation to export from the United States.

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Supply Voltagemax Vsup

1.26V

Data Ram Size

64 kB

Moisture Sensitive

Yes

Package Description

FBGA-325

Number Of Logic Array Blocks Labs

2308 LAB

Core

ARM Cortex M3

Number Of Cores

1 Core