Fiyat için teklif alın
Adet ve teslim süresine göre fiyatlandırılır.
Sevkiyat
Stoktan aynı gün hazırlık
Orijinal ürün
Doğrulanmış tedarik
RoHS
Compliant
Destek
Teknik ekip desteği
Teknik Özellikler
- Command User Interface
- YES
- Number Of Words Code
- 256000000
- Package Shape
- RECTANGULAR
- Terminal Adımı
- 0.8 mm
- Data Polling
- NO
- Terminal Pozisyonu
- BOTTOM
- Number Of Sectorssize
- 2K
- Page Size
- 2K words
- Memory Width
- 8
- Üretici Parça No
- NAND02GW3B2CZA6F
- REACH Uyumluluk Kodu
- unknown
- Access Time
- 25000
- Qualification Status
- Not Qualified
- Package Code
- FBGA
- Toggle Bit
- NO
- Number Of Words
- 268435456 words
- Readybusy
- YES
- Access Timemax
- 20 ns
- Package Equivalence Code
- BGA63,10X12,32
- Jesd30 Code
- R-PBGA-B63
- Package Style
- GRID ARRAY, FINE PITCH
- Part Life Cycle Code
- Obsolete
- Supply Currentmax
- 0.02 mA
- Interface
- Parallel
- Memory Ic Type
- FLASH
- Sector Size
- 128K
- Memory Density
- 2147483648 bit
- Parallelserial
- PARALLEL
- Ihs Manufacturer
- MICRON TECHNOLOGY INC
- Temperature Grade
- INDUSTRIAL
- Package Description
- FBGA, BGA63,10X12,32
- Package Body Material
- PLASTIC/EPOXY
- Rohs Code
- Yes
- Organization
- 256MX8
- Power Supplies
- 3/3.3 V
- Terminal Formu
- BALL
- Operating Temperaturemax
- 85 °C
- Operating Temperaturemin
- -40 °C
- Standby Currentmax
- 0.00005 A
- Number Of Terminals
- 63