MX30LF1GE8AB-XQI

Teknik Özellikler

Package Code

VFBGA

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Terminal Adımı

0.8 mm

Parallelserial

PARALLEL

Fonksiyon Sayısı

1

REACH Uyumluluk Kodu

unknown

Tip

SLC NAND TYPE

Part Life Cycle Code

Active

Tepe Reflow Süresi (maks. sn)

NOT SPECIFIED

Number Of Terminals

48

Uzunluk

8 mm

Package Shape

RECTANGULAR

Genişlik

6 mm

Programming Voltage

3 V

Memory Ic Type

FLASH

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

ECCN Kodu

EAR99

Organization

128MX8

Number Of Words Code

128000000

Yüzey Montaj

YES

Package Body Material

PLASTIC/EPOXY

Operating Temperaturemin

-40 °C

Number Of Words

134217728 words

Memory Width

8

Operating Temperaturemax

85 °C

Seated Heightmax

1 mm

HTS Kodu

8542.32.00.51

Memory Density

1073741824 bit

Terminal Formu

BALL

Jesd30 Code

R-PBGA-B48

Supply Voltagenom Vsup

3 V

Temperature Grade

INDUSTRIAL

Terminal Pozisyonu

BOTTOM

Ihs Manufacturer

MACRONIX INTERNATIONAL CO LTD

Package Description

VFBGA,

Supply Voltagemax Vsup

3.6 V

Operating Mode

ASYNCHRONOUS

Supply Voltagemin Vsup

2.7 V