KSM26SED8/16ME

Teknik Özellikler

Parça Durumu

Obsolete

Minimum Operating Temperature C

0

Module

DRAM Module

Mounting

Socket

Ecc Support

Yes

Data Bus Width Bit

72

Operating Current Ma

1629

Eccn Us

EAR99

RoHS Durumu

RoHS Compliant

Package Length

69.6

Maximum Operating Temperature C

85

Supplier Package

SODIMM

Hts

8473.30.11.40

Number Of Chip Per Module

18

Maximum Clock Rate Mhz

2666

Package Width

3.7(Max)

Module Type

260SODIMM

Organization

2Gx72

Number Of Ranks

Dual

Pcb Changed

260

Chip Configuration

1Gx8

Chip Package Type

FBGA

Cas Latency

17

Chip Density Bit

8G

Module Density

16Gbyte

Pin Sayısı

260

Package Height

30

Typical Operating Supply Voltage V

1.2